Course Descriptions


NMT211 - Safety and Equipment Overview for Nanofabrication Credits: 3
This course will provide an overview of basic semiconductor industry processing equipment and materials handling procedures with a focus on maintenance, safety, environment, and health issues. Topics to be covered will include: cleanroom maintenance, safety, and health issues, vacuum pumping maintenance, environmental, safety, and health issues (covering direct drive mechanical, Rootes blowers, turbomolcular, and dry mechanical systems); furnace maintenance, safety, environmental, and health issues (covering horizontal, vertical, rapid thermal annealing tools); chemical vapor deposition system maintenance, safety, environmental, and health issues (covering gas delivery, corrosive and flammable gas storage and plumbing, regulators, and mass flow controllers); and vacuum deposition/ etching system maintenance, safety, environment, and health issues (covering microwave and RF power supplies and tuners, heating and cooling units, vacuum gauges, valves, and, process controllers). Specific materials handling issues will include DI water, solvents, cleansers, ion implantation and diffusion sources, pho­toresists and developers, metals, dielectrics, toxic, flammable, corrosive, and highpurity gases, and packaging materials.
Prerequisites: CHE 151, GET 251 or GET 252.

NMT212 - Basic Nanofabrication Processes Credits: 3
This course will cover in detail the thermal processing necessary for semicon­ductor fabrication. Growth and annealing processes, which utilize horizontal and vertical furnaces, will be examined as well as rapid thermal annealing. This course will cover single crystal growth (Czochralski, float-zone) as well as wafer slicing, etching, polishing, epitaxial growth, and substrate (bulk or epi) specifications. The course will address the impact of thermal processing and thermal processing history on defects, gettering, impurities and overall device properties. The student will grow and measure gate and field oxides, implant and activate source anti­drain regions, and evaluate thermal budget requirements using state-of-the-art tools.
Prerequisites: CHE 151, GET 252.

NMT213 - Thin Films in Nanofabrication Credits: 3
The basics of thin films including growth, structure, mechanical properties, electrical properties, deposition equipment will be examined in the first part of this course. This will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtering, thermal evaporation, and beam evaporation physical vapor deposition. Materials to be considered will include dielectrics (nitride, oxide), polysilicon (doped and undoped), and metals (aluminum, tungsten, copper, adhesion promoters, diffusion barriers) The second part of the course will focus on etching processes and will emphasize reactive ion etching (single water, batch), high-ion-density reactors (TCP, helicon, ECR, MERIE) and ion beam etching. Student will receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools.
Prerequisites: CHE 151, GET 252.

NMT214 - Lithography for Nanofabrication Credits: 3
This course will cover all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. Most of the emphasis will be on understanding the nature and behavior of photoresist materials. The second section examines the process from development through inspection (both before and after pattern transfer). This section will introduce optical masks, aligners, steppers and scanners. In addition, CD control and profile control of photoresists will be investigated. The last section will discuss advanced lithographic techniques such as e-beam, X-ray, EUV, and ion beam lithography.
Prerequisites: CHE 151, GET 252.

NMT215 - Materials Modification in Nanofabrication Credits: 3
In this course the student will learn about the manufacturing issues involved in metal interconnects, dielectrics and final device assembly. Aluminum, refractory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test will be examined.
Prerequisites: CHE 151, GET 252.

NMT216 - Characterization, Packaging and Testing of Nanofabricated Structures Credits: 3
This course examines a variety of measurements and techniques essential for device fabrication. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and re­sistivity/conductivity measurements will be used on real samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and C-V and I-V tests.
Prerequisites: CHE 151, GET 252.